Intelligent controllable material magnetorheological elastomers (MRE) were used as polishing pads in chemical-mechanical polishing.The magnetron polishing effect of MRE polishing pads with different magnetron parameters(particle type,particle mass fraction,particle size,and solidified magnetic field strength) on single-crystal SiC was investigated,and the magnetron material removal mechanism of MRE polishing pads was analyzed.The results show that compared to Fe3O.4 magnetic particles,MRE polishing pad prepared with carbonyl iron powder (CIP) magnetic particles shows a 52.2% increase in material removal rate (MRR) during SiC polishing.The larger the CIP mass fraction,the larger the MRR of polishing,the smaller the surface roughness,and the better the surface quality of polishing due to a larger material modulus and more CIP particles in contact when the CIP mass fraction is higher.The difference in magnetron polishing effect of MRE polishing pads with different magnetic particle grain sizes is not significant.The grain size influences the removal effect of the polishing process through the size of the particles and the contact probability,which is related to the contact state of the surface.Compared to isotropic MREs,anisotropic MRE prepared by applying curing magnetic field can obtain better magnetron polishing effect.The MRE polishing pad prepared at a curing magnetic field of 140 mT has the best polishing effect,which can increase the MRR of SiC by 31.0% and reduce surface roughness by 50.0% under a polishing magnetic field of 335 mT compared to non magnetic field polishing.The material removal mechanism of magnetic control polishing by MRE polishing pad is that the applied magnetic field increases the mechanical properties of the MRE polishing pad,and the abrasive has a greater cutting force and positive pressure on the SiC surface,thereby achieving greater material removal.