The slurry is one of the key elements of copper interconnection chemical mechanical polishing (CMP),each component plays different functions in the CMP process,while the selection and performance of corrosion inhibitor directly affect the post-polishing surface quality.The research progress of various types of corrosion inhibitors in copper interconnection CMP and the synergy between corrosion inhibitors and different types of additives in recent years was reviewed,the mechanism of action between corrosion inhibitors and different types of additives was introduced.The future prospects for the application of corrosion inhibitors in copper interconnection CMP were presented.It is pointed out that the development of green and environment-friendly CMP inhibitor for copper interconnection,the improvement of polishing quality through the synergistic effect of inhibitor compounding,and the further revelation of the mechanism of inhibitor from the microscopic perspective are the future research directions.