Particle distribution of abrasive has a great influence on chemical mechanical polishing(CMP) of sapphire,while traditional polishing model can not illustrate the effect of particle distribution.Focused on the problem,the abrasives of two different particle diameter were mixed to enlarge the distribution effect of particle diameter on polishing sapphire,the influence of single abrasive and mixed abrasives of two different particle diameter on the polishing rate was studied.Results show twodiameter abrasive hybrid can efficiently increase removal rate of sapphire,and the removal rate can reach the maximum value at a certain mass ratio of twodiameter abrasive.The bigger the particle diameter difference between two abrasives,the higher the removal rate of sapphire.The particle hybrid influences the polishing temperature and the service life of abrasive,that is because the particle hybrid can increase the number of hydroxyl group,the contact area for density stacking between abrasive and sapphire.A dynamic process of polishing using hybrid abrasive was discussed,and the polishing dynamic model was presented.