In order to achieve high quality surface and green finishing of InP,the orthogonal test was carried out to study the effects of the speed of finishing plate,magnetic pole,workpiece,and the oscillation on the material removal rate (MRR) and surface roughness of finishing.The regression equation model reflecting the relationship between material removal rate,surface roughness and polishing process parameters were established by regression analysis.The results show that among the polishing process parameters,the speed of workpiece is the most important factor for MRR and the oscilation rate has the least impact on MRR,the speed of plate is the most important factor for surface roughness and the speed of magnetic pole has the least impact on surface roughness.After 3 h polishing,the surface roughness of InP wafer can be reduced to 0.35 nm from 33 nm and the material removal rate can reach to 2.5 μm/h under the optimal finishing parameters (the speed of finishing plate is 40 r/min,the speed of workpiece is 500 r/min,the speed of magnetic pole is 30 r/min,and the oscillation rate is 200 mm/min),which indicates that the sub-nanometer surface roughness of InP wafer can be obtained using the cluster magnetorheological finishing with dynamic magnetic fields.The coefficient of goodness of fit between the results of the regression model of MRR and surface roughness and the experimental results are 0.984 2 and 0.937,respectively,which indicates that the regression model of MRR and surface roughness using regression analysis can effectively predict the effect of cluster magnetorheological finishing with dynamic magnetic.